Must be enrolled in a Bachelor’s Degree program prior to and post internship.  

Target Internship Duration: May-Aug 2026 or June-Sept 2026. 

Location: this position is fully in office, in Burlington, MA.

 Visa sponsorship is not available for this role. For clarity purposes, this means that Oracle is not in a position now, or in the future, to offer US immigration sponsorship. This includes, but is not limited to, support of H-1B, TN, O-1, green card or F-1 e.g. EAD, OPT, CPT, I-20, F-1 visa stamp etc. 

The Oracle Hardware Development (OHD) organization in Burlington, MA is looking for a Thermal Mechanical intern to work with our mechanical and thermal design team to support all phases of our development life-cycle, including design, simulation, documentation, and testing/validating prototype thermal designs and measuring airflow in our HW lab.

The Company:

Oracle is the world’s leading provider of business software. With a presence in over 175 countries, we are one of the biggest technology companies on the planet. We're using innovative emerging technologies to tackle real-world problems today. From advancing energy efficiency to reimagining online commerce, the work we do is not only transforming the world of business—it's helping advance governments, power nonprofits, and giving billions of people the tools they need to outpace change. For more information about Oracle (NYSE:ORCL), visit us at oracle.com.