**Job Summary:** onsemi is currently seeking an experienced Process Engineer to work on product qualification (NPI/NPD, fab transfer, In-sourcing, others as deemed necessary) and safe launch lots for ultrasonic wirebond and IVI processes for all the product groups. Lead investigation on issues / EFAR cases related to ultrasonic wire bonding process under NPI category and lead WB technology and material roadmap. **Competencies** + Leading WB Set-up fo New Product Introductions + Knowledge on Orthodyne and KNS/Power fusion wirebond platforms with deep understanding on the parameters, materials and tools. + Establishing **process windows** using DOE and pareto analysis + Ability to improve **Cpk/Cp and DPMO** for WB parameters + Root‑cause analysis of **bond lifts, non‑sticks, wire breaks, cratering** + Correlation of WB defects to **substrate, leadframe, die, and mold compound interactions.** + Driving **safe‑launch strategies and containment plans** + Coordinating WB readiness during **ramp‑up phases** **onsemi** (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. **More details about our company benefits can be found here:** https://www.onsemi.com/careers/career-benefits We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.