At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage, and a pioneering spirit to join forces to invent the future and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, but they’re also making history.
Advanced Technology Lab (ATL) - located outside of Baltimore, Maryland – is where we design, manufacture, and test semiconductor products for internal and commercial production customers as well as emerging technology programs. Northrop Grumman’s ATL semiconductor foundry has unique capabilities supporting a range of production microelectronic devices (Silicon, Gallium Arsenide, Gallium Nitride, Silicon Carbide, Carbon Nanotubes) and providing leading edge technology development in superconducting electronics. Our devices enable several Northrop Grumman’s ground-based radars, avionic radars, and space systems.
Join us for the chance to work with an experienced and talented team while helping serve your country. Enjoy the opportunity to grow and learn with a variety of challenging projects in production, R&D, ongoing long-term programs, and new programs targeting future military platforms.
We are looking for you to join our team as a Senior Principal Microelectronics Process Engineer based out of Linthicum, MD.
We are seeking a highly motivated and experienced professional to join our team in a production and manufacturing role. You'll get to work on mechanical manufacturing processes, process improvement, and technical leadership, collaboratively engaging with teams to deliver high-quality products.
In this role, you will be responsible for developing and refining manufacturing processes, work instructions, and production layouts required to fabricate products. You will be responsible for developing and refining manufacturing processes, work instructions, and production layouts required to fabricate and assemble products at both the wafer and die levels. You will support process flow development from wafer AOI (Automated Optical Inspection) through die-level inspection, pick-and-place assembly, tape-and-reel operations, and final product packaging.
You will respond to design and specification changes, capture technical details, and ensure seamless integration of improvements into the manufacturing process. Additionally, you will support troubleshooting, equipment maintenance, and safety initiatives while partnering with internal teams and external vendors.
Key responsibilities include analyzing processes and equipment for capability and downtime, monitoring yield and scrap data, and driving root cause analysis with corrective actions for discrepancies. You will also contribute to procurement specifications for new equipment, establish facility safety requirements, and work as part of an Integrated Product Team to meet customer needs. This position requires proven technical leadership, strong problem-solving skills, and the ability to interpret 2D drawings in support of production and engineering objectives:
Process Development & Control: Develop and optimize manufacturing processes, including wafer- and die-level AOI, pick-and-place assembly, tape-and-reel packaging, and final product handling. Write detailed work instructions and ensure alignment with quality standards.
Inspection & Quality: Utilize AOI equipment for wafer and die inspection to identify defects, ensure compliance with specifications, and support yield improvement initiatives. Analyze inspection data to detect patterns, trends, and opportunities for corrective actions.
Assembly Operations: Oversee pick-and-place processes to ensure precision in die placement, bonding, and alignment. Support the integration of automated equipment and collaborate with vendors for equipment troubleshooting and upgrades.
Packaging Operations: Support tape-and-reel activities to meet customer-specific delivery requirements, ensuring consistency in packaging quality and traceability.
Continuous Improvement: Identify process improvements, capture feedback from operations, and implement changes into manufacturing. Lead root cause analysis and corrective actions for yield and scrap issues.
Cross-Functional Collaboration: Work as part of an Integrated Product Team, supporting both internal engineering and external customers. Partner with maintenance, safety, and operations staff to troubleshoot, repair, and upgrade equipment.
Data Analysis & Reporting: Analyze yield, scrap rate, and equipment downtime data to drive process optimization. Monitor process capability and equipment performance for continuous improvement.
Leadership & Safety: Provide technical leadership, generate specifications for new equipment, and establish facility safety requirements in line with industry standards.
Basic Qualifications:
Bachelor’s Degree in Mechanical Engineering, Electrical Engineer, or Software Engineering with 8+ years of relevant experience; Master’s Degree in Mechanical Engineering, Electrical Engineer, or Software Engineering with 6+ years of relevant experience or 4+ years of experience with a PhD.
Hands-on experience with wafer-level and die-level Automated Optical Inspection (AOI) systems.
Familiarity with tape-and-reel packaging processes and JEDEC packaging standards. Ability to read and interpret 2D drawings and technical specifications.
Knowledge of ESD, MSL, and cleanroom handling practices. Experience working in a production or manufacturing environment.
Develop manufacturing processes, work instructions and production layouts required to fabricate the product.
Identify process improvements, capture feedback from Operations and incorporate changes into the manufacturing process. Respond to design and specification changes by capturing details into the manufacturing process. Respond to technical production issues associated with the product being fabricated.
Generate specifications for procurement of new equipment.
Analyze yield and scrap rate data to aid in improving processes.
Experience with working on automation equipment and/or machinery.
U.S. Citizenship and the ability to obtain and maintain a DoD Secret clearance is required.
Preferred Qualifications:
Master’s degree in Mechanical, Manufacturing, or Electrical Engineering.
5+ years of experience in semiconductor packaging, assembly, or microelectronics manufacturing.
Experience developing manufacturing work instructions and process documentation.
Familiarity with SPC (Statistical Process Control), FMEA, and Lean Six Sigma methodologies.
Assist in establishing safety requirements for facilities and equipment.
Proven ability to analyze yield, scrap rate, and downtime data to drive continuous improvement.
Demonstrated experience working in cross-functional teams to resolve production issues.
Experience with automated pick-and-place assembly equipment.
Experience interfacing with equipment vendors or troubleshooting and process upgrades.
Proven technical leadership experience.
Work as part of an Integrated Product Team to support both internal and external customers.
Work in a multifunctional team to solve production related issues.
Work with maintenance staff or vendors to troubleshoot and repair production specific equipment.
Analyze processes and equipment for process capabilities and downtime.
Proven track record of implementing process automation and efficiency improvements.
Strong technical leadership experience with the ability to mentor junior engineers or technicians.
Experience in lean manufacturing practices and structured problem-solving methodology
Experience working in semiconductor or microelectronics fab.
Experience developing technical specifications for process material procurement
Experience developing technical specifications for equipment procurement
Active Secret clearance
Primary Level Salary Range: $131,100.00 - $196,700.00The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions.Depending on the position, employees may be eligible for overtime, shift differential, and a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates.Northrop Grumman is an Equal Opportunity Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO and pay transparency statement, please visit http://www.northropgrumman.com/EEO. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.