Job Description
Job Purpose:
The Senior Packaging NPI Staff Engineer is responsible for leading Wafer-Level Chip-Scale Package (WLCSP) new product introduction activities from development through volume production. This role serves as the primary technical and program interface to customers, while coordinating crossfunctional global teams to ensure successful execution of schedule, cost, quality, reliability, and cost objectives.
The position requires deep WLCSP technical expertise, strong customer-facing communication skills, and demonstrated experience in board-level reliability evaluation and failure analysis to support customer qualification and risk assessment.
Principal Accountabilities:
NPI, Reliability & Technical Leadershipo Own WLCSP package and process readiness from development through mass production.
o Define and control assembly flow, critical process parameters, materials, and reliability risks.
o Serve as final technical authority for WLCSP-related decisions impacting quality, yield, cost, and reliability.
Board Level Reliability (BLR) & Failure Analysis Leadershipo Own BLR test strategy definition, execution alignment, and technical interpretation.
o Lead failure mechanism identification, root cause analysis, and corrective action definition.
o Correlate package design, material properties, process variables, and PCB interactions to BLR performance.
Customer Technical Interface & Program Leadershipo Act as primary customer-facing technical lead for WLCSP NPI and reliability topics.
o Host and lead customer technical reviews, BLR updates, and issue resolution meetings.
o Ensure customer confidence through clear communication, data-driven analysis, and timely follow-up.
Cross-Functional & Global Team Coordinationo Coordinate global, cross-functional teams across engineering, QA, manufacturing, and supply chain.
o Drive alignment on schedule, deliverables, risk mitigation, and action closure.
o Escalate issues appropriately and facilitate resolution across organizational boundaries
Continuous Improvement & Knowledge Leadershipo Drive process optimization, yield improvement, and reliabilityenhancement initiatives.
o Capture and disseminate best practices, lessons learned, and technical standards.
o Mentor engineers and elevate overall WLCSP technical capability.
Qualifications
Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, or related field.
Typically 10+ years of experience in semiconductor packaging, with strong focus on WLCSP and board-level reliability.
Prior experience in NPI, package engineering, or customer-facing technical roles preferred.
Company Description
Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering product solutions in the automotive, industrial, infrastructure and IoT markets. Our robust product portfolio includes world-leading MCUs, SoCs, analog and power products, plus Winning Combination solutions that curate these complementary products. We are a key supplier to the world’s leading manufacturers of electronics you rely on every day; you may not see our products, but they are all around you.
Renesas employs roughly 21,000 people in more than 30 countries worldwide. As a global team, our employees actively embody the Renesas Culture, our guiding principles based on five key elements: Transparent, Agile, Global, Innovative, and Entrepreneurial. Renesas believes in, and has a commitment to, diversity and inclusion, with initiatives and a leadership team dedicated to its resources and values. At Renesas, we want to build a sustainable future where technology helps make our lives easier. Join us and build your future by being part of what’s next in electronics and the world.
Additional Information
Renesas is an embedded semiconductor solution provider driven by its Purpose ‘To Make Our Lives Easier.’ As the industry’s leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power.
With a diverse team of over 21,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable, power-efficient solutions today that help people and communities thrive tomorrow, ‘To Make Our Lives Easier.’
At Renesas, you can:
Are you ready to own your success and make your mark?
Join Renesas. Let’s Shape the Future together.
Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, disabilities, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.
We have adopted a hybrid model that gives employees the ability to work remotely two days a week while ensuring that we come together as a team in the office the rest of the time. The designated in-office days are Tuesday through Thursday for innovation, collaboration and continuous learning.