INTERN, WIRE BOND PROCESS ENGINEER
onsemi
**JOB DESCRIPTION:**
+ **Support Process Improvement Projects:** Assist in optimizing the wire bond process through SPC and Yield improvement projects.
+ **Collaborate with Engineers:** Work closely with equipment and process engineers to align the machine and process controls per device group.
+ **Data Collection and Analysis:** Perform data collection, analysis, and report results to support improvement projects and validation efforts.
+ **Technical Knowledge Development:** Gain hands-on experience with wire bond tools and techniques, and learn about the entire assembly process flow.
+ **Process Optimization:** Assist in performing Design of Experiments (DOE), wire bond validation, and assessments.
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