RELOCATION ASSISTANCE: No relocation assistance available

CLEARANCE TYPE: Interim Secret

TRAVEL: Yes, 10% of the Time

Description

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.

Northrop Grumman Mission Systems is a trusted provider of mission-enabling solutions for global security. We have a wide portfolio of secure, affordable, integrated, and multi-domain systems and technologies. Our differentiated battle management and cyber solutions deliver timely, mission-enabling information and provide superior situational awareness and understanding to protect the U.S. and its global allies.

 

Northrop Grumman Mission Systems is looking for you to join our team as a Microelectronics Semiconductor Product Engineer for our Advanced Packaging Technology facility in Apopka, Florida.

 

For more than 70 years, Northrop Grumman’s Microelectronics Center has pushed the boundaries in this ever-evolving field of microelectronics. Our two U.S.-based government-trusted foundries and state-of-the-art packaging facilities set the standard, designing and delivering millions of defense and commercial microelectronics each year. From innovative design to precise fabrication, our mission-tailored solutions provide unparalleled performance, ensuring our technology meets the most demanding challenges.

 

The Microelectronic Semiconductor Product Engineer will analyze wafer probe test electrical data, track/monitor program metrics (delivery & yield), investigate and resolve technical issues as part of a cross-functional team, and lead team efforts to drive cost and schedule improvements. The selected candidate engineer will work closely with program managers, functional engineering staff (product, test, assembly, design, process, quality), and operations, serving as the engineering POC for any product-related technical and production issues.

The selected candidate must have excellent verbal and written communication skills; be able to multi-task in a fast-paced, dynamic, and high-visibility environment; and work well as part of a team.

 

This position will demand large amounts of time working in a cleanroom environment. Some lifting and standing will be required.

What you will get to do:

Problem-Solving: 

Drive process improvements for yield, reliability, and cost volume manufacturing using statistical tools, DOE techniques, data driven decision making and systematic problem-solving skills.Lead Root Cause and Corrective Action (RCCA) task forces to troubleshoot and develop solutions that prevent recurrence for excursion incidents using 8D problem solving methodologies

Quality Control:

Execute strategic projects for improvement of sustaining operations through monitoring statistical process control (SPC) charts and disposition of out of spec material.Support process control, planning, safety, and quality organizations to ensure the equipment meets cost, quality, safety, and reliability metrics.Use Failure Mode and Effects Analysis (FMEA) to assess and mitigate risk for critical processes, process modules, and tools.

Documentation & Data Systems: 

Maintain accurate records and produce detailed reports for all data analysis and investigations performed.Support engineering data analysis including metrology data, ERP and MES data, and other in-process metrics.

The ideal candidate will possess excellent interpersonal and critical thinking skills, as well as excellent verbal, written, and presentation skills. They will also have the ability to formulate, communicate and execute complex project plans and initiatives.

Basic Qualifications for Principal Microelectronics/Semiconductor Metals Process Engineer:

Bachelor's degree in Electrical Engineering or related STEM discipline with a minimum of 2 years of Semiconductor Product Engineering experience or 2 or more years of Semiconductor Process Engineering experience.

Experience with semiconductor processing.

Experience with data & statistical analysis using data analysis tools (JMP, Minitab, R, MATLAB, Python, Tableau, etc).

Experience with Statistical Process Control (SPC), and Six Sigma concepts for process development and control.

Experience in collaborating with and contributing to cross functional technical teams to achieve short and long-term goals.

Experience reading and interpreting technical drawings, test specifications, and manufacturing/test procedures.

Experience with Radio Frequency (RF) fundamentals.

Experience with Enterprise Resource Planning and Manufacturing Execution Systems.

Experience with MS Office suite.

US Citizenship is required.

Ability to obtain Secret Clearance is required.

Preferred Qualifications for Principal Microelectronics/Semiconductor Metals Process Engineer:

Experience in 8D Problem Solving.

Experience with SAP MRP software.

Experience with analog, digital and RF device test and characterization techniques.

Experience with solid state physics or other relevant engineering physical science disciplines.

Experience with semiconductor product qualification tests & industry standards.

Experience with lithography, plasma descum, wet cleans, electroplating, etch, AOI and reflow.

Active Secret Clearance or Higher.

Six Sigma Blackbelt Certification.

What We Can Offer You:
Northrop Grumman provides a comprehensive benefits package and a work environment which encourages your growth and supports the mutual success of our people and our company. Northrop Grumman benefits give you the flexibility and control to choose the benefits that make the most sense for you and your family. 

Your benefits will include the following: Health Plan, Savings Plan, Paid Time Off and Additional Benefits including Education Assistance, Training and Development, 9/80 Work Schedule (where available), and much more!

Primary Level Salary Range: $79,300.00 - $118,900.00

The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions.

Depending on the position, employees may be eligible for overtime, shift differential, and a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.

The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates.

Northrop Grumman is an Equal Opportunity Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO and pay transparency statement, please visit http://www.northropgrumman.com/EEO. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.