The Northrop Grumman Microelectronics Center (NGMC) of Northrop Grumman Mission Systems is seeking an exceptionally talented, motivated, and creative Associate Characterization Fab Engineer / Characterization Fab Engineer (3rd shift) position located at our Linthicum, MD facility - required to be fully on-site.
The Advanced Technology Lab (ATL), part of Northrop Grumman Microelectronics Center (NGMC), located outside of Baltimore, Maryland - where we design, manufacture, and test semiconductor products for internal and commercial production customers as well as emerging technology programs. Northrop Grumman's ATL semiconductor foundry is a unique capability supporting a range of production microelectronic devices (Silicon, Gallium Arsenide, Gallium Nitride, and Silicon Carbide) and providing leading-edge technology development in Superconducting Electronics and SLCFET. Our devices enable a number of Northrop Grumman's ground-based radars, avionic radars, and space systems.
The Characterization Fab Engineer will be responsible for but not limited to:
Being the first line of defense for the Characterization Engineering fab issues, spending upwards of 60-70% of shift in the cleanroom
Maintain existing and creating new in-line metrology and defect metrology recipes and techniques
Be hands-on with microscopes for visible inspection
Assisting with ongoing efforts to integrate in-line defect metrology into our process flows
Supporting operations in addressing lot holds across the fleet of Characterization Engineering tool sets
Partner with vendors and equipment engineers to keep tools in good health and ready-to- use state
Supporting statistical process control (SPC), continuous improvement efforts, and the management and dissemination of metrology and defect metrology data
This position may be filled as a Associate Characterization Fab Engineer /or Characterization Fab Engineer
Basic Qualifications for Associate Characterization Fab Engineer (3rd shift):
Bachelor’s degree in Electrical Engineering, Chemical Engineering, Materials Engineering and Mechanical Engineering, Chemistry, Physics or other related technical discipline with 0 year of relevant experience.
General understanding of defect inspection and review tools (such as dark field, bright field, and scanning electron microscopes)
General understanding of metrology (such as CD SEMs. litho overlay tools, surface topology profilers, thin film thickness measurement tools) or analytical tools
Ability to work 3rd shift hours (11PM-8AM Mon-Fri); Option of 5x8 or 9/80B schedule
Basic knowledge of statistical process control
Hands on experience with Si, GaAs, or other wafers
Ability to work in a cleanroom setting
U.S. Citizenship required.
The ability to obtain and maintain a DoD Secret clearance is required.
Basic Qualifications for Characterization Fab Engineer (3rd shift):
Bachelor’s degree in Electrical Engineering, Chemical Engineering, Materials Engineering and Mechanical Engineering, Chemistry, Physics or other related technical discipline with 2 years of relevant experience
General understanding of defect inspection and review tools (such as dark field, bright field, and scanning electron microscopes)
General understanding of metrology (such as CD SEMs. litho overlay tools, surface topology profilers, thin film thickness measurement tools) or analytical tools
Ability to work 3rd shift hours (11PM-8AM Mon-Fri); Option of 5x8 or 9/80B schedule
Basic knowledge of statistical process control
Hands on experience with Si, GaAs, or other wafers
Ability to work in a cleanroom setting
U.S. Citizenship required.
The ability to obtain and maintain a DoD Secret clearance is required.
Preferred Qualifications:
Hands on knowledge and operation of defect inspection and review tools (such as dark field, bright field, and scanning electron microscopes)
Hands on knowledge and operation of metrology (such as CD SEMs, litho overlay tools, surface topology profilers, thin film thickness measurement tools) or analytical tools
Experience in lean manufacturing practices and structured problem-solving methodology
Experience working in a cleanroom setting
1 year experience with semiconductor fabrication
Data analysis and visualization (JMP)
Experience developing technical specifications for equipment procurement
Active Secret clearance
Primary Level Salary Range: $70,600.00 - $106,000.00Secondary Level Salary Range: $85,400.00 - $128,000.00The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions.Depending on the position, employees may be eligible for overtime, shift differential, and a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates.Northrop Grumman is an Equal Opportunity Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO and pay transparency statement, please visit http://www.northropgrumman.com/EEO. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.